High precision thermal stress study on flip chips by synchrotron polychromatic x-ray microdiffraction

Kai Chen, N. Tamura, Wei Tang, M. Kunz, Yi-Chia Chou et al.<br/> The bending and residual stress of flip chips caused by the mismatch of thermal expansion between the chip and the substrate have been measured by polychromatic microfocused synchrotron x-ray beam. Precise orientation information as a function of position on the chip was obtained from Laue diffracti … [J. Appl. Phys. 107, 063502 (2010)] published Tue Mar 16, 2010.